| Performance | Value | Notes |
| Heat Resistance |
Td5%＞450°C |
Air, argon atmosphere |
| Flame Retardancy |
Total heat of combustion < 10 kJ/g Peak heat release rate: 48.3 W/g |
PCFC |
| Light Transmittance |
＞80% |
1 mm thick in the visible light region |
| Roughness |
0.325Rq(nm) |
SPM scanning area: 10 × 10 μm² |
| Damping modulus |
2.32Gpa |
Nanoindentation Testing |
| Hardness |
0.30 GPa |
Flexible Electronics and Displays: Used as a transparent substrate or protective layer for flexible displays, touchscreens, and flexible circuit boards, leveraging its bendable, lightweight, and impact-resistant properties to replace traditional glass.
Optical Device Packaging: Used in LED packaging, particularly in applications requiring high light transmittance and resistance to thermal shock; also used in the manufacture of lenses, optical discs, and optical fibers.
High-Performance Functional Coatings: Used as wear-resistant and stain-resistant coatings for touchscreens, or as transparent protective layers for solar cells, combining transparency, hardness, and self-cleaning properties.
Advanced Electronics and Sensors: Used for potting or toughening sensors, flexible optoelectronic devices, and semiconductor components, leveraging its flexibility and electrical insulation properties.
